Market Trends of Asia Pacific LED Packaging Industry
This section covers the major market trends shaping the APAC LED Packaging Market according to our research experts:
Increasing Demand for Energy-efficiency Significantly Drives the Market
- Owing to the sheer increasing efficiency of LED lighting systems, the Asia-Pacific region has been experiencing a fundamental transition in its deployed lighting systems, with firms in the regions embracing LEDs in multiple sectors.
- Multiple governmental and private initiatives have been driving the need for smart and efficient lighting systems in the modernization and development of infrastructure such as smart cities across the region, which directly boosts the market for LED packages in the region.
- Government initiatives for energy efficiency in the Asia Pacific region immensely contribute to the development of the LED packaging market. Several Government schemes and plans are in progress in countries such as India and China to promote energy efficiency. Unnat Jyoti by Affordable LEDs for All (UJALA) initiative by the Indian Government to encourage energy efficiency in the country launched in 2015 has already distributed more than 36 crores LED light bulbs as of August 2021.
- The increase in the adoption of high-end consumer electronics, like wearable and smartphones in China, Japan, Inda, among others, also significantly increases the demand for micro-LED and flash LED packages, which tend to be significantly efficient as compared to previous generation displays.
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Chip Scale Package (CSP) is Expected to Grow Significantly Over the Forecast Period
- A chip scale package (CSP) LED package has a close-ratio between the volume of the LED chip and the total volume of the LED package. It is essentially a bare LED die on which a phosphor layer is coated, with the underside of the die metalized with the P and N contacts to form the electrical connection and thermal path.
- The growing demand for CSP LED architecture is the latest incarnation of flip-chip LEDs and prevents light loss due to the mounting of electrode pad on the upside of the P-type GaN layer while improving heat transfer efficiency and package reliability.
- Vendors in the market are introducing new products to maintain their competitive advantage. For instance, Samsung introduced LM101B CSP LEDs that use a film phosphor in the conversion layer to reduce surface roughness and enable uniform control of thickness with small color dispersion. The fillet-enhanced CSP (FEC) technology forms TiO鈧� (Titanium dioxide) walls around the chip surface to reflect its light output toward the top, enabling the mid-power CSP to deliver an industry-leading efficacy of up to 205 lm/W (65mA, CRI 80+, 5000K).
- Moreover, some of the vendors offer Chip Scale Package (CSP) LEDs to a specific application. For instance, OSRAM designs CSP LEDs for high-class retail lighting in brand fashion boutiques and jewelry stores. Professional designs for customized CoB and small luminaires are the main applications being supported by CSP.
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