Market Share of High Bandwidth Memory Industry
The high bandwidth memory market is highly fragmented. The market is highly competitive and consists of several major players. This industry's competitive rivalry primarily depends on sustainable competitive advantage through innovation, market penetration, and competitive strategy power. Since the market is capital-intensive, the barriers to exit are also high. Some of the key players in the market are Intel Corporation, Toshiba Corporation, and Fujitsu Ltd.
- April 2024 - TSMC signed a Memorandum of Understanding with SK Hynix to develop next-generation HBM (high bandwidth memory) and a next-generation packaging technology. SK Hynix intends to utilize TSMC鈥檚 sophisticated logic processes for the foundational component of HBM4, aiming to incorporate more features within the confined space, which is anticipated to boost both the performance and energy efficiency of its memory chips.
- March 2024 - Camtek Ltd announced that it received a new order for approximately USD 25 million from a tier-1 HBM manufacturer for the inspection and metrology of high bandwidth memory (HBM). Most of the systems are expected to be delivered in the second half of 2024.
High Bandwidth Memory Market Leaders
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Micron Technology, Inc.
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Samsung Electronics Co. Ltd.
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SK Hynix Inc.
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Intel Corporation
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Fujitsu Limited
*Disclaimer: Major Players sorted in no particular order
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