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High Bandwidth Memory Market Analysis

The High Bandwidth Memory Market size is estimated at USD 2.52 billion in 2024, and is expected to reach USD 7.95 billion by 2029, growing at a CAGR of 25.86% during the forecast period (2024-2029).

High bandwidth memory (HBM) is a high-speed computer memory interface for 3D-stacked SDRAM, usually used with high-performance graphics accelerators, network devices, and supercomputers.

Major factors driving the growth of the high bandwidth memory (HBM) market include the growing need for high bandwidth, low power, and highly scalable memories, increasing adoption of artificial intelligence, and a rising trend of miniaturization of electronic devices.

By stacking up 8 DRAM dies on the circuit and interconnecting them with TSVs, HBM offers a substantially higher bandwidth while using less power in a relatively minor form factor. Also, with 128-bit channels and a total of 8 channels, the HBM offers a 1,024-bit interface. A GPU with four HBM stacks would provide a memory bus with 4,096 bits.

For instance, in June 2024, US memory chip maker Micron Technology built test production lines for advanced high bandwidth memory chips in the United States. The company is considering manufacturing HBM in Malaysia for the first time to capture more demand from the AI boom.

With the growing graphics application, the appetite for fast information delivery (bandwidth) has also increased. Therefore, HBM performs better than GDDR5, which was used earlier in terms of performance and power efficiency, resulting in growth opportunities for the high bandwidth memory market.

Moreover, the major semiconductor vendors worked with reduced capacity due to the COVID-19 pandemic. Additionally, due to the shortage of laborers, many packages and testing plants in China reduced or even stopped operations. This created a bottleneck for chip companies that rely on such back-end packages and testing capacity.

However, some factors driving the market's growth include the increasing adoption of artificial intelligence, increasing demand for low power consumption, high bandwidth, highly scalable memories, and a rising trend of miniaturization of electronic devices.

High Bandwidth Memory Industry Segmentation

High bandwidth memory (HBM) is the high-speed computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM). It works with high-performance network hardware, high-performance data center AI ASICs, FPGAs, and supercomputers.

The high bandwidth memory (HBM) market is segmented by application (servers, networking, consumer, and automotive and other applications) and geography (North America [United States and Canada], Europe [Germany, France, United Kingdom, and Rest of Europe], Asia-Pacific [India, China, Japan, and Rest of Asia-Pacific], and Rest of the World).

The market sizes and forecasts are provided in terms of value (USD) for all the above segments.